Microvias into the Millennium

Larry W. Burgess

Several methods for producing microvias in Printed Circuit Boards have been tested for producing Z-axis interconnections in the past few   years, but only two are finding their may into production. These two microvia methods are photo via and laser drilled via technologies. Multi-depth blind microvias are clearly one of the most economically proven methods for interconnecting today's dense circuit boards. Both stacked and staggered via methods are being used to make multi-depth interconnections. While there are definite advantages from "buildup" circuit board methodologies, the more conventional fabrication methods still prevail. Laser drilling has recently taken the leadership  position as one of the "production" accepted methods in the circuit board marketplace for producing blind microvias, especially within  Surface Mount Pads.

Bio:
Larry W. Burgess has over thirty years in the interconnect packaging disciplines. He holds a Bachelor's Degree in chemistry and has held Management and Engineering Management positions at Fortune 100 electronic companies. He is president and Chief Technical Officer at MicroPak Laboratories, Inc., where he has licensed technology to Sandia National Laboratories. MicroPak has recently formed a joint venture with Pluritec. Currently, Mr. Burgess is preparing to open a series of Laser Drilling Centers in North America to support the upcoming demand for laser drilled blind microvias.